Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
A16858-05In Stock
Real-time quotes
Laird Technologies - Thermal Materials
8349TFM-25ML42
$33.279
MG Chemicals
TH235-2-50G-4JAR1
$64.56
Penchem Technologies Sdn Bhd
1188134In Stock
$146.6075
LOCTITE
TH855-5-50G-4JAR2
$74.9952
Penchem Technologies Sdn Bhd
TH855-5-30G-4SYR4
$114.0624
Penchem Technologies Sdn Bhd
65-00-T670-008027
$80.3738
Parker Chomerics
65-00-T630-0010In Stock
$26.263
Parker Chomerics
S-PUTTY2-98515
$391.1495
Shiu Li Technology Co., Ltd.
21-430SF-001-010M10
$10.5148
Jones Tech
153-Q-NCIn Stock
$95.7514
Wakefield-Vette
252G107
$86.5873
Aavid, Thermal Division of Boyd Corporation
156-K-NCIn Stock
$60.998
Wakefield-Vette
TGPK27PIn Stock
Real-time quotes
t-Global Technology
159900F00000GIn Stock
$341.5963
Aavid, Thermal Division of Boyd Corporation
TG-NSP25-60In Stock
Real-time quotes
t-Global Technology
4949GIn Stock
$63.0141
Aavid, Thermal Division of Boyd Corporation
21-440-001-030M10
$13.5691
Jones Tech
TT4000136
$9.317
Shiu Li Technology Co., Ltd.
2761872In Stock
$278.6963
Bergquist
- 1
- 2
- 3
- 4
- 5
- 6
- 29
SUBSCRIBE
Subscribe to receive our offers