Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
TG-PP10-500In Stock
Real-time quotes
t-Global Technology
TC3-3.5G36
$11.8105
Chip Quik Inc.
P0200-209
$26.044
Littelfuse Inc.
21-340B-001-030M7
$13.3239
Jones Tech
21-361-001-030M10
$23.7964
Jones Tech
GF3500S35-00-60-400CCIn Stock
$292.4
Bergquist
A16858-03In Stock
Real-time quotes
Laird Technologies - Thermal Materials
9460TC-3ML48
$14.4503
MG Chemicals
TT3000-15027
$125.9024
Shiu Li Technology Co., Ltd.
21-725G-001-150M5
$146.8419
Jones Tech
CT40-5225
$23.5849
Chemtronics
A13717-05In Stock
Real-time quotes
Laird Technologies - Thermal Materials
TH930-50G-2JAR4
Real-time quotes
Penchem Technologies Sdn Bhd
65-00-T670-0001414
$28.1993
Parker Chomerics
TIC1000A-00-00-25CC4
$106.9058
Bergquist
A16872-03157
$88.1434
Laird Technologies - Thermal Materials
65-02-TC50-0030In Stock
$36.2074
Parker Chomerics
21-361-001-180M1
$88.3011
Jones Tech
103800F00000G62
$23.3639
Aavid, Thermal Division of Boyd Corporation
TH855-5-50G-2JAR4
$33.9405
Penchem Technologies Sdn Bhd
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